QDR SRAM  

JEDEC Approves QDRTII Family of High-Speed SRAM Products

QDRII/DDRII architectures, the industry-standard SRAM memory for high-speed networking, offer speeds up to 333MHz, an ultra-wide data-valid window and small footprint FPGA package

SAN JOSE, Calif., March 20, 2002 - The QDR co-development team today announced that JEDEC has approved the complete specifications for the team's Quad Data RateT II (QDRII) and Double Data RateII (DDRII) SRAM product architectures. JEDEC is the standardizing body for the solid-state electronics section of the Electronic Industries Alliance (EIA), a trade association that represents all areas of the electronics industry. JEDEC has been one of the leading developer of standards for the solid-state industry since 1958.

These QDRII/DDRII SRAM specifications set the second-generation, high-performance communications memory standard for network switches, routers, and other communications applications. The approval to adopt QDR specifications as a JEDEC standard was passed by the JEDEC board of directors at a recent association meeting.

JEDEC's approval of the QDRII/DDRII architectures validates customer recognition that these devices constitute an industry standard for high-speed networking SRAM. QDRII and DDRII are already widely used in OC192 and OC768 applications. The QDRII specification is also being adopted as the standard for the Network Processor (NP) Forum as the basis for Phase 1 of the Look-Aside Interface (LA-1).

The architectures provide the specifications necessary to enable the team's QDRII and DDRII devices to operate at speeds up to 333 MHz, while providing an ultra-wide data valid window of 65 percent of the clock cycle. Now designers have a complete SRAM solution for any high-speed networking application.

The QDR co-development team unites the industry's leading SRAM manufacturers in a collaborative effort to define proprietary networking SRAM architectures. Current team members include Cypress, Micron, IDT, NEC and Samsung. Hitach signed a letter of intent to join the QDR co-development team and is currently finalizing a formal agreement with the other QDR team members.

The new JEDEC standards extend to the package and pin rotation specifications of QDRII and DDRII devices with densities up to 288 Mb. The package and unique pinout standard is suitable for all products in the QDRII/DDRII family, including QDRII and DDRII common I/O and separate I/O devices. The 165-pin FBGA provides customers with the flexibility to design for future density and performance migrations while achieving a 40 percent space savings over the traditional 209-ball, 14mm x 22mm BGA or 100-pin TQFP packages. For more information on the specifications, please visit the QDR SRAM website at www.qdrsram.com.

About QDR

In 1999, the QDR co-development team was created to define a new family of SRAM architectures for high-performance communications applications. In a revolutionary relationship, participating companies work closely together to ensure multiple sources for new QDR SRAMs by developing pin- and function-compatible products. The QDR family of SRAM products incorporates extensive input from networking industry leaders. QDR devices have two ports running independently at twice the rate of conventional synchronous memories, resulting in four data items per clock cycle. The QDR family of products includes Quad Data Rate and Double Data Rate common and separate I/O definitions. Depending on the application, products in the QDR SRAM family can more than double SRAM device efficiency per pin.

Quad Data RateT and QDRT SRAM comprise a new family of products developed by Cypress, IDT, Micron Technology, Inc., NEC and Samsung. Any other trademarks referenced herein are the property of their respective owners.


"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Statements herein that are not historical facts are "forward-looking statements" involving risks and uncertainties, including by not limited to: the effect of global economic conditions, shifts in supply and demand, market acceptance, the impact of competitive products and pricing, product development, commercialization and technological difficulties, and capacity and supply constraints. Please refer to the companies' Securities and Exchange Commission filings for discussions of such risks

QDR and Quad Data Rate SRAMs comprise a new family of products developed by Cypress, IDT, Micron Technology, Inc., NEC and Samsung. All registered trademarks or trademarks are the property of their respective owners.

Contact

Cypress Semiconductor
John Donovan
(408) 943-4885
JDI@cypress.com

Micron
Echo Chadwick
(208) 368-4543
echadwick@micron.com

Samsung Semiconductor, Inc.
Geoffrey Hughes
(408) 544-4122
ghughes@ssi.samsung.com

NEC Corporation
Daniel Mathieson
+81 (3) 3798-6511
d-mathieson@bu.jp.nec.com

IDT
Dianna Pailthorpe
(408) 492-8210
diana.pailthorpe@idt.com
Hitachi, Ltd.
Chieko Yoda
+81 (3) 5201-5250
yoda-chieko@sic.hitachi.co.jp
NEC Electronics Inc.
Michelle Healy
(408) 588-6620
michelle_healy@el.nec.com
Samsung Electronics, Co., Ltd.Sunghae Park
+82 (31) 209-7037
sunghae@samsung.co.kr
Hitachi Semiconductor (America) Inc.
Akiko Ishiyama
(408) 456-2180
akiko.ishiyama@hsa.hitachi.com

 

     
Cypress
Hitachi
IDT
NEC
Samsung

Hari Thiagarajan

Rob Raghavan

Jonas Litonjua

 

SJ Han

O.S. Kwon

 

©2006 Cypress, Hitachi, IDT, Micron, NEC, and Samsung

QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress Semiconductor, Hitachi, IDT, Micron Technology, Inc., NEC, and Samsung.